ABOUT US

CHOICE OF EMBEDDED IT SOLUTIONS (INDIA) PVT. LTD.

Meeting the varying needs of low volume high mix/high volume low mix products with same efficiency

Provide quality products to customers complying board assemblies as per IPC standards

Lead-free manufacturing and assembly lines to meet special customers needs

Box-build assembly capabilities

TOTAL EMS SOLUTIONS

Embedded IT Solutions (India) Pvt. Ltd., provide services that include new product prototyping with FMEA, simple to high technology PCBA manufacturing capability and build-to-order systems assembly. Our products are manufactured by high-end SMT technology machines to meet global quality standards and are supported by a dedicated after market services and repairs.

QUALITY, DELIVERY AND COST

With a strong technical and expertise in handling highly complex, low volume lean and 6σ manufacturing. Embedded IT Solutions (India) Pvt. Ltd., provides flexible and cost effective solutions. High quality, on-time delivery performance along with competitive prices to customers.

SERVICES PROVIDED

New product prototyping for manufacturing feasibility

Lean and 6σ manufacturing for high mix, Low volume, low mix, high volume PCBA and Box build assembly

Market services and repairs to provide after sales-support

    FACILITY

    Import/Export tax free

    Contract manufacturing located in SEZ

    ISO 9001(2015) & ISO 14001 certified

    IATF 16949 under certification

    Close proximity to airport & seaport

    20mins to Hyderabad international airport

    Nearest seaport krishnapatnam, Chennai & Mumbai

    Sprawling area of 10 acres

    50K sq.ft. of available floor area

    Deployable area for future expansion

    Sophisticated manufacturing lines

    Automatic DG set for 100% Power Back-up

    Environment friendly premises

    FEATURES

    Latest fuji (AIMEX IIIC)

    3D solder paste inspection

    Automated Optical Inspection (AOI)

    2.5D X-ray inspection

    RoHS compliance, Lead-free with nitrogen capability

    System integration and box-build capability

    Low volume high mix/high volume low mix manufacturing

    Build To Order (BTO), Configure To Order (CTO) systems

    Mounting > 4 million Components/day

    Placement accuracy of ±50µ for chips and ±40µ for ICs

    Ability to handle tiniest chip size of 01005

    PCB handling capability from 0.4mm to 2.6mm thickness

    Component placement capacity with 0.3mm pitch

OUR PRODUCT RANGE


Our boards are being used in sophisticated products catering for various commercial and industrial segments.

WIFI MODULES
DEVICES
GPS TRACKING
DEVICES
POINT-OF-SALE
TERMINALS
BIOMEDICAL
DEVICES
WIRELESS
COMMUNICATION SYS
TRAIN COLLISSION
AVOIDANCE SYSTEMS
SMART LIGHTING
CONTROL SYSTEMS
UPS AND POWER
SUPPLY SOLUTIONS
LED DRIVERS
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APPLIANCES

CERTIFICATIONS & COMPLIANCES

EIS Recognition and Awards

CERTIFIED FOR ISO 9001:2015 INTERNATIONAL QUALITY MANAGEMENT SYSTEMS

CERTIFIED FOR ISO 14001:2015 INTERNATIONAL ENVIRONMENT MANAGEMENT SYSTEMS

COMPLIANCE WITH EUROPEAN UNION ROHS INSTRUCTIONS REQUIREMENTS

COMPLIANCE WITH ANSI S20.20 -2014 ESD REQUIREMENTS STANDARDS

CERTIFIED FOR IATF 16949:2016 INTERNATIONAL QUALITY MANAGEMENT SYSTEM



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